PMMI Scholarships

2024 Bill Zito Scholarship (Deadline November 15, 2024)

Established in honor of Packaging Hall of Famer and longtime Enercon Industries Corporation Employee Bill Zito. Enercon is a PMMI Member Company that supplies induction cap sealers,  corona treaters, and plasma surface treaters. Bill Zito was an active PMMI member and strongly believed in the importance of education in the packaging field.

Each year the PMMI Foundation provides over $200,000 in scholarships to students looking to enter the packaging and processing industries upon graduation.

Chuck Yuska Scholarship

The Chuck Yuska Scholarship was established for PMMI’s former President & CEO of 28 years. Mr. Yuska was an influential force in growing PMMI and the association’s trade show, PACK EXPO, representing innovation in the packaging industry.

Criteria:

  • Currently attending a North American college or university
  • Academic Achievement: GPA 3.0 or higher
  • Area of study: Engineering, packaging, processing, mechatronics, or related field

Electrical Engineering Scholarship

This scholarship in the amount of $5,000 is awarded to one student attending a North American 4-year college or university with a focus on electrical engineering.

Criteria:

  • Currently enrolled at a North American 4-year college or university
  • Major in electrical engineering
  • Academic Achievement: GPA 3.0 or higher
  • Awards & Recognition
  • Internship/industry involvement

Enercon Industries' Bill Zito Scholarship

Established in honor of Packaging Hall of Famer and longtime Enercon Industries Corporation Employee Bill Zito. Enercon is a PMMI Member Company that supplies induction cap sealers,  corona treaters, and plasma surface treaters. Bill Zito was an active PMMI member and strongly believed in the importance of education in the packaging field.

The Enercon Bill Zito scholarship ($1,500) will be awarded to the candidate who best meets the following criteria:

  • Currently attending a PMMI Partner School.
  • A third-year student majoring in packaging engineering or related areas.
  • Excellent academic achievement plus a recommendation from faculty.
  • Essay from a student demonstrating interest in the packaging industry.
  • Extra-curricular involvement.
  • Candidate should submit a resume outlining academic and work experience along with an essay.

ISBT Scholarship

ISBT – International Society of Beverage Technologist is awarding two scholarships of $5,000.  The scholarships include one year of membership in the ISBT and free attendance registration to the ISBT annual meeting, BevTech. (Note: ISBT does not provide sponsorship of travel fees, accommodations or other travel related expenses).

Students seeking a technical     degree with applicability to the beverage industry. Examples include Food     Science, Engineering, Food Packaging, Biology, Chemistry, Sustainability, etc.

Minimum GPA of 3.0 (based upon a 4-point scale).

Beverage Industry involvement or interest. Candidates working in the beverage industry or having a clear path to the beverage industry are preferred.

Priority given to students attending an ISBT partner schools (Michigan State, Purdue, or Clemson).

The ISBT scholarship will be awarded to the candidate who best meets the following criteria:

  • Pursuing a technical degree within the beverage industry
  • Academic Achievement: GPA 3.0 of higher  Area of Study: Food Science, Engineering, Food Packaging, Biology, Chemistry, Sustainability
  • Industry experience/involvement

John A. Kowal Memorial Scholarship

The scholarship was established in memory of one of OMAC’s founding members, John A. Kowal, to honor him and his contributions to the field he served for 20+ years – to encourage and support the growth of careers in automation.  This $5,000 scholarship is sponsored by OMAC.

Criteria:

  • Third- or fourth-year student at a North American college or university
  • Area of study: Electrical Engineering/Automation or related areas
  • Academic Achievement: GPA 3.0 or higher
  • Demonstrates commitment to excellence in the industry

Mark C. Garvey Scholarship

Established in memory of the former president and CEO of the Garvey Corporation, a PMMI Member Company. Mark Garvey was a past chairman of PMMI and a long-time supporter of packaging education. He gave significant time and effort to technical schools in the United States and Canada.

Each fall, the Garvey Family awards the scholarship to one PMMI Partner School that demonstrates a commitment to excellence in the packaging industry.

The school selects a student to receive the award, following these criteria:

  • Academic Achievement: GPA 3.0 or higher
  • Major in packaging engineering or related field
  • Demonstrated commitment to excellence in the packaging industry
  • Demonstrated extracurricular involvement

There is no application or deadline for this scholarship.

Mechanical Engineer Scholarship

This scholarship in the amount of $5,000 is awarded to one student attending a North American 4-year college or university with a focus on mechanical engineering or mechanical engineering technology.

Criteria:

  • Currently enrolled at a North American 4-year college or university
  • Major in mechanical engineering
  • Academic Achievement: GPA 3.0 or higher
  • Awards & Recognition
  • Internship/industry involvement

PACK EXPO Scholarship

The PACK EXPO Scholarship is the beneficiary of PMMI’s PACK gives BACK events at PACK EXPO International and PACK EXPO Las Vegas.  Six $5,000 scholarships are awarded to students attending a North American college or university.

The winners will be announced at the PACK gives BACK event at PACK EXPO.

Criteria:

  • Currently attending a North American college or university
  • Academic Achievement: GPA 3.0 or higher
  • Area of study: Engineering, packaging, processing, mechatronics, or related field

Packaging & Processing Women's Leadership Network Scholarship

The PPWLN scholarship was established to support women’s careers in the packaging and processing industry. This $5,000 scholarship is awarded to a female student at a North American college or university looking to pursue a career in packaging or processing.

Criteria:

  • Academic Achievement: GPA 3.0 or higher
  • Demonstrates leadership qualities and the potential to lead the future of packaging and processing
  • Area of study: Engineering, packaging, processing, mechatronics, or related field

PMMI Member Family Scholarship

The PMMI Member Family Scholarship supports immediate family members of PMMI member company employees who are interested in packaging and processing as a career choice. These $5,000 scholarships will be awarded annually to the top fifteen applicants.

Candidates for the PMMI Member Family Scholarship must:

  • Be an employee or immediate family member (parent, child, step-child, sibling, or spouse) of an employee at a member company that is in good standing with PMMI, The Association for Packaging and Processing Technologies
  • Student must be enrolled in an accredited 2 or 4-year college, university, or vocational/technical school in North America with a course of study relevant to a business or business-related field with preference given to mechatronics, packaging, or processing curriculum (Please Note: This scholarship does not require the educational institute to be a PMMI Education Partner.)
  • Academic Achievement: GPA of 3.0 or higher

PMMI Scholarship in Memorial of Claude S. Breeden, Glenn Davis, and Art Schaefer

Established in memory of Claude Breeden, Glenn Davis, and Art Schaefer. All of whom were industry leaders and committed to education and workforce development.

Scholarships in the amount of $4,000 are awarded to students attending a 2-year North American college.

Criteria:

  • Currently enrolled in a 2-year program in North America
  • Academic Achievement: GPA 3.0 or higher
  • Plans for a career in packaging/processing machinery manufacturing
  • Awards & Recognition
  • Internship/industry involvement

Processing Scholarship

This scholarship in the amount of $5,000 is awarded to one student enrolled in a processing program at a North American a 4-year college or university.

Criteria:

  • Currently enrolled in a processing program at a North American college or university.
  • Demonstrated commitment to excellence in the processing industry
  • Academic Achievement: GPA 3.0 or higher

Additional Funds

PACK EXPO Travel Assistance

Each year PMMI provides over $85,000 in travel assistance to PMMI Partner Schools wishing to attend PACK EXPO. These funds help cover students’ accommodation and transportation costs.

PMMI Partner Schools are invited to apply for travel assistance. The amount awarded will depend on the total requests received with preference given to those participating in PMMI sponsored student activities, such as The Amazing Packaging Race. The total amount per student will not exceed $250 and funds must be used for student travel to PACK EXPO.

Apply Now for Travel Assistance

PACK EXPO Internship Reimbursement

The PMMI Foundation continues to promote awareness of the packaging and processing industry to the future workforce. There is no better way to showcase the industry to potential leaders than by attending PACK EXPO trade shows. To assist members in bringing interns to PACK EXPO, the PMMI Foundation has developed the PACK EXPO Internship Reimbursement Program.

APPLY NOW FOR REIMBURSEMENT