Chuck Yuska Scholarship
The Chuck Yuska Scholarship was established for PMMI’s former President & CEO of 28 years. Mr. Yuska was an influential force in growing PMMI and the association’s trade show, PACK EXPO, representing innovation in the packaging industry.
- Currently attending a North American college or university
- Academic Achievement: GPA 3.0 or higher
- Area of study: Engineering, packaging, processing, mechatronics, or related field